What role does the surface treatment of electronic stamping parts play?

The surface treatment of electronic stampings refers to the process of plating a thin layer of other metals or alloys on the surface of certain metals using the principle of electrolysis, so as to prevent metal oxidation (such as rust), improve wear resistance, conductivity, reflectivity, Corrosion resistance (copper sulfate, etc.) and enhance aesthetics. The electroplating layer is more uniform than the hot dip layer, and is generally thinner, ranging from a few microns to tens of microns. 

Through electroplating, decorative protective and various functional surface layers can be obtained on mechanical products, and electronic stamping parts that are worn and processed incorrectly can also be repaired.

The surface treatment of electronic stamping parts plays the following roles:

Electronic stamping parts can have a good decorative effect after electroplating. Many of them are decorated with different materials under the premise of taking into account the performance of the surface protection system. The Cu layer and Ni layer play a protective and educational role, while the surface-plated Cr layer can maintain the decorative metallic luster for a long time.

Functional role, electroplating of different materials and surface resistance to high temperature or low temperature, conductivity or insulation, magnetic or magnetic shielding, light enhancement or reflection, lubrication, biocompatibility or biological exclusivity and other new functions, play a new role.

Repair function: The surface of electronic stamping parts is damaged due to corrosion, abrasion or other factors. The surface dimensional accuracy of the workpiece can be restored through single or composite surface treatment technology, and can be redesigned to give it equal to or even exceed the surface performance and social function of the new product, so as to improve the remanufacturing of the workpiece, assembly or product.

In addition to the above-mentioned functions, the surface treatment of electronic stampings has other functions, such as the use of electrodeposition technology in surface engineering technology, magnetron sputtering technology can be used to prepare nanoparticles, nanofilms, and thermal spraying technology to prepare nanostructures Materials, etc.